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HEPCO, Inc. has designed and built component lead
forming equipment in its Sunnyvale, California facility since the early
1970’s. Working with some of the
world's largest sub-contract assemblers and OEMs here in the fast-paced
Silicon Valley environment places HEPCO in a unique position in the industry. Our vast client list encompasses the
smallest start-up companies to the largest in EMS, aerospace and
semiconductor manufacturing, for whom we provide lead forming solutions from
single-stroke forming to bowl-fed systems. HEPCO has recently expanded its line to include PCB
de-paneling equipment for routed PCBs.
Also introduced is a new BGA Sphere
Placement System which uses vacuum pick-up and placement of spheres for
an entire array at once, and provides a mechanically-correct method of
bumping or reballing BGA components. Please feel free to contact
us if you should have any questions regarding our products and services. (408) 738-1880 -or- info@hepcoblue.com GOT LEAD-FREE??? 02/18/05 – HEPCO Introduces
Desktop X-Ray Lead (Pb) Detection System Download .pdf
or .doc press release!!! Download .pdf of
LeadHound© Literature Click Here to Learn More!
Copyright © 2010 HEPCO, Inc. All rights reserved.
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