

BGA Reballing - Tired of paying someone to pay operators to soak your
expensive components in water & scrub off the burned paper/flux? Tired of having to
reball components more than once because of sloppy flux or ball alignment? ACCURATELY
REBALL YOUR OWN COMPONENTS IN-HOUSE with HEPCOs Model 9000 BGA SOLDER SPHERE
PLACEMENT SYSTEM. Our self-contained desktop system uses vacuum and custom tooling to
place an entire Ball Grid Array at once. Unlike the rice paper/water or the
kids game method using gravity and loose balls, our system is the
fastest, cleanest, simplest, most accurate method on the market. Its the only one
that uses a clean & correct process similar to the one used to originally create your
components - at a fraction of the cost! We can make fixtures to Reball up to 8 components
at once, and we can even handle Micro-BGAs with ball sizes as small as .012
(.3mm)
Lead Forming & Cutting - For over 20 years, HEPCO has been the world's leading
manufacturer of quality automated Component Lead Prep Equipment. Our machines have
formed and cut billions of parts for the biggest companies in the industry. Please
call or email us for more information on any of HEPCO's Products.
info@hepcoblue.com