HEPCO, Inc. : BGA Rework : Reballing : PCB Assembly : CBGA : FBGA : SOIC : PBGA : QFP : GPD : Excelta : Finetech : Reed Switch : Thyristor : PCB Connector

<body> <p align="center"><img src="Images/weblogo1.jpg" alt="HEPCO, Incorporated" WIDTH="252" HEIGHT="144"><img src="Images/Banner.jpg" alt="(408) 738-1880" WIDTH="500" HEIGHT="144"></p> <p> </p> <p align="center">BGA Reballing - Tired of paying someone to pay operators to soak your expensive components in water & scrub off the burned paper/flux? Tired of having to reball components more than once because of sloppy flux or ball alignment? ACCURATELY REBALL YOUR OWN COMPONENTS IN-HOUSE with HEPCOs Model 9000 BGA SOLDER SPHERE PLACEMENT SYSTEM. Our self-contained desktop system uses vacuum and custom tooling to place an entire Ball Grid Array at once. Unlike the rice paper/water or the kids game method using gravity and loose balls, our system is the fastest, cleanest, simplest, most accurate method on the market. Its the only one that uses a clean & correct process similar to the one used to originally create your components - at a fraction of the cost! We can make fixtures to Reball up to 8 components at once, and we can even handle Micro-BGAs with ball sizes as small as .012 (.3mm)</p> <p>Lead Forming & Cutting - For over 20 years, HEPCO has been the world's leading manufacturer of quality automated Component Lead Prep Equipment.  Our machines have formed and cut billions of parts for the biggest companies in the industry.  Please call or email us for more information on any of HEPCO's Products.</p> <p align="center"><a href="mailto:info@hepcoblue.com?HEPCO Website Inquiry (No Frames)">info@hepcoblue.com</a></p> </body>